Integrator & OEM Solutions

Integrator & OEM Solutions for Real-Time Package Quality, Container Quality and Integrity Testing

Integrators are responsible for incorporating technology into a production or packaging line. PTI's sensory technologies - Airborne Ultrasound, Vacuum Decay, MicroCurrent HVLD and Force Decay technologies can be integrated for automated package, & container quality control.

Inspection solutions built to fit the most challenging applications.
Easy, scalable technologies for integration into your packaging line
A variety of sensory technology platforms for CCI, package and seal quality inspection are available

Airborne Ultrasound Technology for Seal Quality Inspection

Seal-Scan® and Seal-Sensor utilize Airborne Ultrasonic Technology (ABUS) that inspects and analyzes pouch seals non-destructively. PTI works closely with industry leaders to integrate PTI’s Seal-Sensor inspection technology into their equipment for automated seal quality control on the production line. Seal-Scan Integrator Package for non-destructive in-depth seal quality analysis. Seal-Scan provides C-Scan imaging and detailed seal analysis, producing pixel by pixel evaluation of seals (Opto-Acoustic image). Seal-Scan characterizes the overall quality and uniformity of the seal.

Seal-Sensor technology provides 100% online seal defect detection of the final pouch seal

Sensor easily mounts on conveyors and pouch handling systems
Rapid linear scan (L-Scan) of pouch seal provides immediate seal check/verification of pouch seal quality inline at high outputs
Test result data produced in seconds

Vacuum Decay Technology for Package and Container Integrity Leak Testing

PTI’s vacuum decay technology is an ASTM Test Method F2338, developed using the VeriPac platform. Vacuum Decay is a deterministic method to provide reproducible and reliable results for leak testing of high-risk package applications. VeriPac Vacuum Decay technology has been proven to be the most sensitive, most reliable vacuum-based leak test method on the market, backed by decades of dependable performance in the pharmaceutical, biologics, medical device, food and nutrition industries.

Test method is recognized by the FDA as a consensus standard for package integrity testing.
Listed in ISO 11607 and USP Chapter <1207> guidance.

VeriPac Vacuum Decay technology solutions for integration are adaptable and scalable to reliably test a variety of package formats, ranging from flexible packaging to rigid containers and parenteral products.

Show more Show Less

Download

PTI-Integration-OEM-Solutions-Brochure

MicroCurrent HVLD Technology Module for Automated Parenteral CCI

PTI's HVLD technology platform has evolved to provide full integration of MicroCurrent HVLD for container closure integrity into parenteral fill-finish applications. PTI’s MicroCurrent HVLD changed the landscape for capacitance-based leak detection, providing safe and more dynamic testing capability for liquid parenterals, both small and large molecule products.

PTI’s MicroCurrent HVLD technology uses unique voltage characteristics to inspect a wide range of parenteral products. Traditional HVLD has proven to be an effective solution for standard parenteral products but requires a level of conductivity for the liquid contents of the package. PTI’s MicroCurrent HVLD increases the range of liquid conductivity that can be tested, with the technology capable of testing water for injection (WFI) and other liquids in the single-digit micron range.

Deterministic, Quantitative Test Method Provide:

Hard traceable data
Discrete pass/fail limits
The ability to calibrate a system
Avoidance of subjective influences in results
A reliable test method that can be validated and rolled out globally

Show more Show Less

Force Decay Technology for Package Integrity Leak Testing

Force Decay is a practical solution for leak testing packages with low-headspace. It is a non-destructive technique that does not alter or damage packages being tested. Force Decay technology is capable of measuring force from the surface deflection of a package during a normal vacuum-based test cycle. Certain types of packages can be tested in multiple during a single test cycle. Vacuum levels are monitored during the test cycle to evaluate the package using the ASTM F2338 vacuum decay leak test method. The location of the defective package or blister cavity is identified.

Package quality assurance is achieved by deploying accurate, reliable, non-destructive inspection methods that remove subjectivity from the testing process. The VeriPac 410 Force Decay inspection technology utilizes a combination of Vacuum Decay technology and differential force measurement to identify defective packages. The VeriPac 410 allows tested products to be returned to the production line and eliminate the cost and waste associated with destructive leak test methods. The 410 addresses all issues associated with low volume flexible and semi-flexible package leak testing.

914.337.2005